无卤PI覆铜箔基材 Halogen-Free Polyimide Film Based FCCL - 湖北奥马电子科技有限公司官方网站

无卤PI覆铜箔基材 Halogen-Free Polyimide Film Based FCCL

产品特点:
优异的耐高温高湿性能
良好的尺寸安定性、挠曲性及耐离子迁移
优良的电性能,化学性能及耐热性能
不含卤素, 阻燃性能达到UL94 VTM-0
本产品符合IPC规范

Feature:
Excellent high humidity and temperature resistance
Excellent dimensional stability,High flexibility and
Excellent Migration ability
Excellent electrical ,chemical and thermal property
Halogen free and Flame retardancy UL 94VTM-0
Meet with IPC standards

产品特性(FCCL Characteristic):
特性
property
单位
Unit
条件
Condition
标准
Standard
AFES131218
AFES131212
AFES252018
测试方法
Test method
PI Film
Adhesive
Copper Foil
Peel Strength
Kgf/cm
(90˚)
normal
H mil≧0.8
1 mil≧1.0
1.3~1.5
1.1~1.3
1.3~1.7
IPC-TM-650 2.4.9
Dimension Stability
TD
%
Method B
≦±0.15
0.05~0.10
0.04~0.09
0.06~0.10
IPC-TM-650 2.2.4
MD
%
-0.07~0.04
-0.05~-0.08
-0.06~0.05
Solder Float Resistance
---
300℃/10sec
No Change Appearance
Pass
Pass
Pass
IPC-TM-650 2.4.13
Chemical Resistance
%
NaOH
≦20
1~7
1~7
1~7
IPC-TM-650 2.3.2
%
HCI
1~8
1~8
1~8
%
IPA
1~7
1~7
1~7
Moisture Absorption
%
D-24/23
≦2.0
0.9~1.2
1.0~1.3
1.0~1.3
IPC-TM-650 2.6.2
Volume Resistance
Ω-cm
C-96/23/65
≧1012
≧1014
≧1014
≧1014
IPC-TM-650 2.5.17
Surface Resistance
Ω
C-96/23/65
≧1010
≧1012
≧1012
≧1012
Insulation resistance
Ω
C-96/23/65
≧109
≧109
≧109
≧109
IPC-TM-650 2.6.3.2
Dielectric constant 10MHZ
---
C-48/40/90
≦4.0
3.4~3.6
IPC-TM-650 2.5.5.3
Dissipation factor 10MHZ
---
C-48/40/90
≦0.04
0.032~0.036
Note:1. Data shown above are nominal values for reference only,Details see Certification of Quality
  2. Storage Condition:Vacuum Packaging: Below 30℃ for 1year,
Normal Packaging : Below 30℃,below 70% RH for 1year